8100-SMT12 0.5mm Universal

QFP SMT Magic Pads: Pitch 0.5mm

Pin Count from 4 to 304, including 208 and 240 Pin QFP Devices.

0.50mm Spacing (20 mil spacing). Ground plane on reverse side.

8100-SMT11

SMT Adapters for QFP 80 Packages. Two different footprints. 0.50mm pitch.

SMT 80 pin QFP packages. Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping.

0.50mm Spacing (20 mil spacing). Ground plane on reverse side.

Board Size: 6"x4"

8100-SMT10

SMT Adapters for TSSOP Packages. 0.50mm pitch.

SMT TSSOP 0.50mm Spacing (20 mil spacing).

Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping.

Ground plane on reverse side.

Board Size: 6"x4"

8100-SMT9

SMT Adapter for TSOP 40, 48 & 56 (20 mil Spacing), PSOP 44 (50 mil Spacing) & SSOP 56 (30 mil Spacing).

Board Size: 7.9"x3.1"

8100-SMT8

SMT Adapters for SOIC medium, tiny, metric and plastic miniflat packages.

Board Size: 6.0"x4.0"

8100-SMT7

SMT Adapters for QFP, TQFP and SQFP Packages 240, 208, 144, 128 and 100

Front side: QFP208, TQFP144, TQFP100 Back side: QFP240, TQFP128 Pad to Pad Spacing: 20mil Array of non-committed through holes on 0.1" grid Material FR-4 UL Flammability Class 94v-0 Thickness .062 inches Plated hole size .035 in Diameter Drilled hole size .042 in Diameter

Board Size: 4.2"x4.2"

8100-SMT6

SMT Adapters for Quad Flat Pack (QFP) Packages 160, 100 and 44

Pad to Pad Spacing: 25mil

Board Size: 4.2x4.2

8100-SMT5

Quad Flat Pack (QFP) Package 208 SMT adapter extends the signals of the package to plated through holes on a 100 mil grid.

Ground plane on solder side.

8100-SMT4

SMT Adapters for SOIC medium, wide, metric and plastic miniflat packages.

SOIC medium, wide, metric and plastic miniflat package SMT adapter extends the signals of the packages to plated through holes on a 100 mil grid.
Ground plane on solder side.

Pad to Pad Spacing: 50 mil

Board Size: 6.0"x4.0"

8100-SMT3

SMT Adapters for PLCC package's 20, 28, 44, 64 and 84 pin packages and socket families.

PLCC 20, 28, 44, 64 and 84 pin package SMT adapter extends the signals of the packages to plated through holes on a 100 mil grid.
Ground plane on solder side.

Board Size: 6.0"x6.0"

8100-SMT2

SMT Adapters for Quad Flat Pack (QFP) Packages 144, 128, 100-3, 100-2, 80-3, 74, 64-4, 64-1, 52, 48, 44-2

SMT adapters extend the signals of the following packages to plated through holes on a 100 mil grid: Quad Flat Pack (QFP) Packages 144, 128, 100-3, 100-2, 80-3, 74, 64-4, 64-1, 52, 48,44-2

Pad to Pad Spacing: 20mil (100-2, 100-3, 144)

Pad to Pad Spacing: 25mil (44-2, 48, 64-1, 80-3, 128)

Pad to Pad Spacing: 30mil (52, 64-4, 74)

Ground plane on solder side.

Board Size: 12.0"x10.0"

8100-SMT1

SMT adapters supporting: 20,28, 44, 68, or 84 Pin PLCC Packages (6); Narrow and wide SOIC packages; 80 and 100 pin controller packages.

SMT adapters extend the signals of the following packages to plated through holes on a 100 mil grid: 20, 28, 44, 68 or 84 Pin PLCC Packages (6) Narrow and wide SOIC packages.

80 and 100 pin controller packages.

Ground plane on solder side.

Board Size: 10.0"x15.0"

BGA-256-1.0mm

Surface mount BGA adapter.

Designed for BGA 256 components.

1mm pitch.

All pads break out to dedicated plated through holes.

BGA-256-1.27mm

Surface mount BGA adapter.

Designed for BGA 256 components.

1.27mm pitch.

All pads break out to dedicated plated through holes.