Custom Interconnect solutions
Custom Engineering Services

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Adapters-Plus offers thousands of custom solutions for a wide variety of applications. Obsolescence, and, Footprint Conversion Adapters are primary purposes. Our experienced staff can assist you in determining which of our solutions will best fit your application.

We offer quick turn solutions. Lead times are dependant on several variables, such as availablity of components that are needed to build the adapters. If all components are readily available we can often deliver in 1-2 weeks.

As long as it is mechanically, and electrically possible we can design a custom module from any type package to any type footprint.

Some examples:

BGA TO BGA MODULES (signal re-routing)

Soic-dip

SSOP TO SOIC

QFN SOCKET TO QFN SMT FOOTPRINTS

QFP TO PLCC

QFP TO DIP

QFP TO PGA

QFP TO BGA

TSOP TO BGA