Adapters-Plus MCGA socket is designed for a variety of applications: test, development, and production. No soldering of device is required. Our design allows BGA devices to be placed onto mating contacts. Our slide Lock lid allows you to remove the device with out removing the screws. This lessons the amount of time needed for insertion, and removal of ic.

Features and Benefits:

• Easily exchange chips in your system without soldering and desoldering
• Ideal for prototypes, and development boards
• Ghz performancelow inductance
• Footprint compatible
• custom variations available
• all footprints supported

Pin Specifications

Material: Brass alloy 360½ hard per QQ-B-626 Finish: 10µ Gold over 100µ Nickel MIL-G-45204

Material Specifications

Standard material:Glass Epoxy FR-4, IPC-4101/24, MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c, Heat deflection Temp(@264 psi) 175c High Temp material: Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ UL: 94V-0, Continuous use temp 250c, Heat deflection Temp (@264 psi) 270c

SOCKETS ORGANIZED BY PITCH, PIN COUNT AND GRID. PARTS IN NUMERICAL ORDER BY PINCOUNT AND GRID.
.8 mm BGA SOCKETS SMT AND THRU-HOLE
Number of positions	Grid Array	Pitch	Body Size	Footprint	Socket Number	Drawing
19 X19 GRID, 1.27MM PITCH
349	19X19	1.27	25X25	1912	CL349SA1912F
472	22x22	1.27	29x29	2217	CL472SA221F
625	25X25	1.00	29X29	2509	CL625SA2509F
19 X 19 GRID, 1.27MM PITCH