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BL Series, Ball Grid Array Screw Lock Sockets

BGA Locking Sockets are built to order, designed for any footprint with .8mm, 1.00mm and 1.27mm pitch. They are ideal for debug, prototype, production test, and development board applicatioins.  

  • Features and Benefits:
  • Fast delivery & competively priced
  • Ideal for prototypes, and development boards
  • Ghz performance
  • low inductance
  • Footprint compatible, solder to existing pad layouts
  • custom variations available
  • all footprints supported
  • available in surface mount or thru-hole

Pin Specifiations

Material: Brass alloy 360½ hard per QQ-B-626 Finish: 10µ Gold over 100µ Nickel MIL-G-45204 Electrical Specifiations

Max Voltage: 50 vac/60 vdc, max current: 1 amp per contact, contact resistance: dry circuit: .01 O max. @ .01 Amps / 5vdc, Dielectric withstanding voltage: 500 Vac Min, Capacitance: 1pf max., self Inductance: 2nH Max.

Material Specifications

Standard material:Glass Epoxy FR-4, IPC-4101/24, MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c, Heat deflection Temp(@264 psi) 175c High Temp material: Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ UL: 94V-0, Continuous use temp 250c, Heat deflection Temp (@264 psi) 270c