- Home
- IC Sockets & Headers
- BGA Sockets, BL Series
BGA (BALL GRID ARRAY)Sockets 0. 8mm, 1.00mm, 1.27mm 1.50mm Pitch
Adapters-Plus BGA sockets offer a complete solution for your prototype and development needs. The BGA socket (locking) is available in our footprint compatible surface mount or in thru-hole. The BGA sockets are machined to order and usual lead-times is 1-2 weeks. Sockets are designed to re-flow solder in place of the compatible BGA device enabling you to do your development on your existing production board. The Socket cover fastens using either four or eight screws depending on the size of the IC. The lid has slide mechanism for easy removal without having to remove the screws. For extra dense mother boards we recommend using the female socket (fbs Series) along with the Thru-hole version of the BL series socket. We also offer heat-sink lids made of Aluminum or copper.
- Features and Benefits:
- Fast delivery & competively priced
- Ideal for prototypes, and development boards
- Ghz performance
- low inductance
- Footprint compatible, solder to existing pad layouts
- custom variations available
- all footprints supported
- available in surface mount or thru-hole
Pin Specifiations
Material: Brass alloy 360½ hard per QQ-B-626 Finish: 10µ Gold over 100µ Nickel MIL-G-45204 Electrical Specifiations
Max Voltage: 50 vac/60 vdc, max current: 1 amp per contact, contact resistance: dry circuit: .01 O max. @ .01 Amps / 5vdc, Dielectric withstanding voltage: 500 Vac Min, Capacitance: 1pf max., self Inductance: 2nH Max.
Material Specifications
Standard material:Glass Epoxy FR-4, IPC-4101/24, MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c, Heat deflection Temp(@264 psi) 175c High Temp material: Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ UL: 94V-0, Continuous use temp 250c, Heat deflection Temp (@264 psi) 270c
| SOCKETS ORGANIZED BY PITCH, PIN COUNT AND GRID. PARTS IN NUMERICAL ORDER BY PINCOUNT AND GRID. |