Adapters-Plus MCGA socket is designed for a
variety of applications: test, development, and production.
No soldering of device is required. Our design allows BGA
devices to be placed onto mating contacts. Our slide Lock
lid allows you to remove the device with out removing the
screws. This lessons the amount of time needed for insertion,
and removal of ic.
Features and Benefits:
Easily exchange chips in your system
without soldering and desoldering
Ideal for prototypes, and development
boards
Ghz performancelow inductance
Footprint compatible
custom variations available
all footprints supported
Pin Specifications
Material: Brass alloy 360½ hard per QQ-B-626
Finish: 10µ Gold over 100µ Nickel MIL-G-45204
Material Specifications
Standard material:Glass Epoxy FR-4, IPC-4101/24,
MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c,
Heat deflection Temp(@264 psi) 175c High Temp material:
Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ
UL: 94V-0, Continuous use temp 250c, Heat deflection Temp
(@264 psi) 270c
SOCKETS
ORGANIZED BY PITCH, PIN COUNT AND GRID. PARTS IN NUMERICAL
ORDER BY PINCOUNT AND GRID.
