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BGA (BALL GRID ARRAY)Sockets 0. 8mm, 1.00mm, 1.27mm 1.50mm Pitch

Adapters-Plus BGA (BALL GRID ARRAY) socket is designed for a variety of applications: test, development, and production. Our BGA socket is designed for easy insertion and removal of IC. Our slide Lock lid allows you to remove the device with out removing the screws from the socket. This reduces the amount of time needed to cycle packages.

Features and Benefits:

  • Fast delivery & competively priced
  • Ideal for prototypes, and development boards
  • Ghz performance
  • low inductance
  • Footprint compatible, solder to existing pad layouts
  • custom variations available
  • all footprints supported
  • available in surface mount or thru-hole
 
Pin Specifiations
Material: Brass alloy 360½ hard per QQ-B-626 Finish: 10µ Gold over 100µ Nickel MIL-G-45204
Electrical Specifiations

Max Voltage: 50 vac/60 vdc, max current: 1 amp per contact, contact resistance: dry circuit: .01 Ω max. @ .01 Amps / 5vdc, Dielectric withstanding voltage: 500 Vac Min, Capacitance: 1pf max., self Inductance: 2nH Max.
Material Specifications
Standard material:Glass Epoxy FR-4, IPC-4101/24, MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c, Heat deflection Temp(@264 psi) 175c High Temp material: Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ UL: 94V-0, Continuous use temp 250c, Heat deflection Temp (@264 psi) 270c
SOCKETS ORGANIZED BY PITCH, PIN COUNT AND GRID. PARTS IN NUMERICAL ORDER BY PINCOUNT AND GRID.

 
 
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