LGA Sockets, 1.50mm Pitch

Pin Specifications

Material: Brass alloy 360½ hard per QQ-B-626 Finish: 10µ Gold over 100µ Nickel MIL-G-45204

Material Specifications

Standard material:Glass Epoxy FR-4, IPC-4101/24, MIL-S-13949/04-GF/GFGUL: 94V-0, Continuous use Temp 150c, Heat deflection Temp(@264 psi) 175c High Temp material: Glass reinforced Polyimide, IPC-4101/42, MIL-S-13949/10-GI/GIJ UL: 94V-0, Continuous use temp 250c, Heat deflection Temp (@264 psi) 270c

SOCKETS ORGANIZED BY PITCH, PIN COUNT AND GRID. PARTS IN NUMERICAL ORDER BY PINCOUNT AND GRID.
1.50mm LGA SOCKETS SMT AND THRU-HOLE
Number of positions	Grid Array	Pitch	Body Size	Footprint	Socket Number	Drawing
15 X 15 GRID, 1.50MM PITCH
193	15x15	1.50		1505	LL193(XX)1505F
225	15x15	1.50	27X27	1510	LL225(XX)1510F
225	15x15	1.50	25X25	1512	LL225(XX)1512F
20 X 20 GRID, 1.50MM PITCH
372	20x20	1.50		2022	LL372(XX)2022F