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CA256-FLASH

Custom Interconnect solutions
Custom Engineering Services

Custom Chip Conversion Adapters

  • Transform your existing IC package footprints to other IC package footprint.

  • Preserve existing PCB’s by avoiding costly re-spins

  • Complete turn-key solutions

  • Surface mount or Thru-hole

  • RoHs or Leaded

Listed below are some examples.

BGA TO BGA MODULES (signal re-routing) Soic-dip, SSOP TO SOIC, QFN SOCKET TO QFN SMT FOOTPRINTS,QFP TO PLCC,QFP TO DIP,QFP TO PGA.QFP TO BGA, TSOP TO BGA.

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Part Number: CA256-FLASH

Description:

256 BGA INTERPOSER WITH PADS FOR EXTERNAL FLASH.

PDF Datasheet

This item is built to order, please call for price and delivery options

Volume Pricing: