BGA Sockets (BL/LL Series)
Footprint-compatible BGA and LGA test sockets.
Mount directly to existing PCB land patterns.
BL/LL Series BGA/LGA Sockets for Prototyping & Testing
The BL/LL Series BGA sockets support a wide range of device footprints—from low pin counts to arrays exceeding 1,000 contacts—while maintaining compatibility with existing PCB layouts.
Standard offerings support 0.80 mm, 1.00 mm, and 1.27 mm pitch configurations. Because these sockets are built to order, mechanical clearance, tail style, and footprint details can be matched to the board you already have in hand.
Surface Mount
Direct SMT mounting to an existing BGA footprint for low-profile applications.
- Typical clearance above PCB: ~0.060″
With FBS
Two-piece configuration for additional clearance for dense PCB layouts.
- Typical clearance above PCB: ~0.130″
- Expandable: Optional female-to-male adapter adds
~0.130″ per adapter
Features & Benefits
Footprint Compatibility
Designed to fit existing BGA/LGA land patterns so you can test devices without a PCB respin.
Development to Production Test
Use the same socket concept from bench validation through screening and production test workflows.
Built to Order
Tailor mechanical and footprint details to match your device drawing and board constraints.
Note: To help avoid interference with nearby passives, the socket body can extend beyond the device footprint by approximately 0.040″ (configuration dependent).
Typical Performance Specifications
Values below reflect typical BL/LL Series configurations. Actual performance can vary by footprint, contact count, and operating environment.
Electrical
| Max Voltage | 75 VAC / 100 VDC |
| Max Current | 1.0 A (per contact) |
| Contact Resistance | 0.01 Ω max |
| Insulation Resistance | 10,000 MΩ min @ 500 VDC |
| Capacitance | 1 pF max |
| Self Inductance | 2 nH max |
Thermal
| Operating Temperature | -55°C to 140°C |
| Resistance to Soldering Heat | 10 seconds @ 288°C |
| Flammability Rating | UL94V-0 |
Materials
| Contacts | Brass Alloy C36000 (ASTM-B16), 1/2 Hard |
| Insulator | FR4-G10 |
How to Order
- Send your IC package drawing (BGA/LGA) and any board constraints (keep-out zones, height limits, nearby components).
- Specify pitch, ball/land count, and preferred mounting (TH/SMT) or clearance approach (BL + FBS).
- We’ll confirm feasibility and provide pricing and lead time.
Typical lead time: Built to order in 2–4 weeks (configuration dependent).
FAQ
Do I need to redesign my PCB?
In most cases, no—these sockets are designed to match existing footprints. Share your device drawing so we can confirm compatibility.
Can you support custom footprints?
Yes. Provide the device package drawing and any special requirements.
What if my board is crowded near the device footprint?
Consider the BL + FBS two-piece approach to reduce interference and improve clearance.
Need help selecting the right socket?
Send your package drawing and board notes. We’ll recommend the best BL/LL configuration for your footprint, clearance, and test method.
Phone: 209-839-0200
Email: sales@adapt-plus.com
