/My Account
🛒 View Cart
(209) 839-0200
BGA and LGA headers with mating female receptacle sockets for high-density PCB interconnect applications

BGA / LGA Headers & Mating Sockets

High-density BGA and LGA interconnect systems for socket interfaces, PCB integration, and modular interface applications.

Overview

BGA / LGA headers and mating sockets provide high-density interconnect solutions for modular interface systems, socket hardware, and PCB-level integration applications.

BGA / LGA Interface Configuration

These interconnect systems support reliable mechanical engagement, controlled stack height, and repeatable electrical connectivity for high pin-count package environments.

Interconnect options are available in multiple pitch, pin-count, and body-size configurations to support development hardware, interface assemblies, and custom PCB applications.

Interface Types: BGA headers, LGA headers, mating female receptacle sockets

Applications: Socket interfaces, PCB interconnect systems, development hardware, custom interface assemblies

Mechanical dimensions, contact geometry, and compatibility specifications are defined at the individual product level. Refer to specific product pages for detailed configuration information.

c product pages for detailed configuration information.

Quick Selection Guide

Start with how the device or target interface connects, then select the appropriate header style and compatible FBS receptacle based on footprint requirements, assembly method, pitch, and stack height.

BHS SERIES — DEVICE-SOLDER INTERFACE

  • Use when: the BGA device solders directly to the top-side interface
  • Best for: controlled stack height and repeatable interconnect engagement
  • Mates with: FBS receptacle sockets, available in SMT or through-hole configurations

LHS SERIES — INTERPOSER-STYLE INTERFACE

  • Use when: solder balls on the interface assembly mate to an LGA interface or SMT BGA footprint
  • Best for: interposers, footprint translation, and multi-device interface applications
  • Mates with: FBS receptacle sockets matched to the target PCB footprint

FBS SERIES — MATING RECEPTACLE OPTIONS

  • FBS SMT: low-profile solder-ball attachment for compact PCB stack-ups
  • FBS Through-Hole: enhanced mechanical retention for serviceable and rugged interface assemblies
BGA/LGA header and mating receptacle socket options shown in exploded and assembled views
FBS SMT female receptacle socket with solder ball interface for BGA and LGA applications

FBS SERIES SMT (SOLDER-BALL)

  • Low-profile SMT attachment for compact PCB stack-ups
  • Reflow-compatible attachment for assembled PCB systems
  • Common in interposers, interface assemblies, and development boards

Need help selecting the correct SMT receptacle configuration for your PCB or interface assembly?


Request FBS SMT Assistance

FBS female receptacle socket with through-hole pins for BGA and LGA interconnects

FBS SERIES THROUGH-HOLE

  • Through-hole termination for secure PCB mounting
  • Enhanced mechanical retention and interface stability
  • Common in prototype fixtures and rugged laboratory hardware

Need help selecting the correct through-hole receptacle configuration for your interface assembly?


Request FBS Through-Hole Assistance

REQUEST FBS ASSISTANCE
LHS series BGA/LGA header with solder ball interface for interposer and footprint adaptation

LHS SERIES (SOLDER-BALL INTERFACE)

  • Solder-ball interface for LGA and SMT BGA footprints
  • Ideal for interposers and footprint translation
  • Common in multi-chip modules and compact interface assemblies

Need help selecting the correct LHS interface configuration for your footprint or PCB assembly?

HS series BGA/LGA header without solder balls for direct device soldering

BHS SERIES (DEVICE-SOLDER INTERFACE)

  • Top-side pads for direct BGA device soldering
  • Robust header interface with controlled stack height
  • Common in development, validation, and repeatable interface applications

Need help selecting the correct BHS header configuration for your device or interface assembly?

REQUEST BHS/LHS ASSISTANCE

BHS SERIES (DEVICE-SOLDER INTERFACE)

  • Top-side pads for direct BGA device soldering
  • Robust header interface with controlled stack height
  • Common in development, validation, and repeatable interface applications

Need help selecting the correct BHS header configuration for your device or interface assembly?


Request BHS Header Assistance

Information Needed to Specify the Right Solution

Provide any available device and PCB details, and we’ll recommend the appropriate header and receptacle configuration for your interface requirements.

  • Pitch: 1.27 mm, 1.00 mm, or 0.80 mm
  • Array Size: Ball or pad count and pattern
  • Target Footprint: BGA land pattern or LGA interface
  • Mounting Style: SMT or through-hole
  • Mechanical Constraints: Stack height, keep-out zones, and clearance requirements
  • Assembly Method: Reflow, selective solder, or hand solder

Need Technical Assistance?

Adapt-Plus provides custom BGA and LGA interconnect solutions for development hardware, interface assemblies, socket integration, and specialized PCB applications.

Our engineering team can assist with footprint matching, stack height selection, receptacle compatibility, and custom interface configurations.


Request Technical Guidance

Get Technical Guidance