SOIC to DIP Adapters
Convert SOIC packages to DIP interfaces for programming, testing, prototyping, and production applications.
Overview
SOIC to DIP adapters convert SOIC packages to standard DIP interfaces for programming, testing, prototyping, and production applications. Adapt-Plus offers reusable socket adapters for device programming and validation, along with solder-down SMT adapters for permanent PCB integration and production use.
Selecting the correct SOIC to DIP adapter requires matching the SOIC package pin count, body width, lead pitch, DIP footprint, and required pin mapping. Browse the tables below to compare available socket and SMT adapter configurations and navigate directly to the appropriate product page.
Socket & Programming SOIC to DIP Adapters
Reusable SOIC to DIP socket adapters are ideal for firmware programming, engineering validation, functional testing, and prototyping where ICs must be inserted and removed repeatedly. These adapters provide a convenient solution for development environments, device evaluation, and production programming without permanently soldering the SOIC device.
| Order | P/N | Supported Device Jedec STD. | SOIC Pitch (mm) | SOIC Body (mm) | SOIC Tip to Tip (mm) | Top Pins (SOIC) | Bottom Pins (DIP) | Socket Type | DIP Span (inches) | Wiring | Supported Devices |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | PA8SO1-03-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 8 | 8 | Open Top | 0.300" | 1:1 | Generic — JEDEC MS-12-150 SOIC-8, 1:1 pin mapping |
| 2 | PA8SO1-03-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 8 | 8 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-12-150 SOIC-8, 1:1 pin mapping |
| 3 | PA14SO1-03-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 14 | 14 | Open Top | 0.300" | 1:1 | Generic — JEDEC MS-12-150 SOIC-14, 1:1 pin mapping |
| 4 | PA14SO1-03-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 14 | 14 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-12-150 SOIC-14, 1:1 pin mapping |
| 5 | PA14SO1-06H-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 14 | 14 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-14, 1:1 pin mapping |
| 6 | PA14SO1-08H-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 14 | 14 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-14, 1:1 pin mapping |
| 7 | PA14SO1-06H-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 14 | 14 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-14, 1:1 pin mapping |
| 8 | PA14SO1-08H-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 14 | 14 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-14, 1:1 pin mapping |
| 9 | PA16SO1-03-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 16 | 16 | Open Top | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-16, 1:1 pin mapping |
| 10 | PA16SO1-06H-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 16 | 16 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-16, 1:1 pin mapping |
| 11 | PA16SO1-08H-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 16 | 16 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-16, 1:1 pin mapping |
| 12 | PA16SO1-03-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 16 | 16 | Open Top | 0.600" | 1:1 | |
| 13 | PA16SO1-06H-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 16 | 16 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-16, 1:1 pin mapping |
| 14 | PA16SO1-08H-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 16 | 16 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-16, 1:1 pin mapping |
| 15 | PA18SO1-06H-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 18 | 18 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-18, 1:1 pin mapping |
| 16 | PA18SO1-08H-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 18 | 18 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-18, 1:1 pin mapping |
| 17 | PA18SO1-06H-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 18 | 18 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-18, 1:1 pin mapping |
| 18 | PA18SO1-08H-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 18 | 18 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-18, 1:1 pin mapping |
| 19 | PA20SO1-06H-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 20 | 20 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-20, 1:1 pin mapping |
| 20 | PA20SO1-08H-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 20 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-18, 1:1 pin mapping |
| 21 | PA20SO1-06H-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 20 | 20 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-20, 1:1 pin mapping |
| 22 | PA20SO1-08H-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 20 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-20, 1:1 pin mapping |
| 23 | PA24SO1-06H-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 24 | 24 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-24, 1:1 pin mapping |
| 24 | PA24SO1-08H-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 24 | 24 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-20, 1:1 pin mapping |
| 25 | PA24SO1-06H-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 24 | 24 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-24, 1:1 pin mapping |
| 26 | PA24SO1-08H-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 24 | 24 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-24, 1:1 pin mapping |
| 27 | PA28SO1-06-3 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 28 | 28 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-28, 1:1 pin mapping |
| 28 | PA28SO1-08-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 28 | 28 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-28, 1:1 pin mapping |
| 29 | PA28SO1-15B-3 | MS-013-variant | 1.27mm | 9.00mm | 11.6mm | 28 | 28 | Clamshell | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .354 SOIC-28, 1:1 pin mapping |
| 30 | PA28SO1-06-6 | MS-013-variant | 1.27mm | 8.4mm | 12.0mm | 28 | 28 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-28, 1:1 pin mapping |
| 31 | PA28SO1-08-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 28 | 28 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-28, 1:1 pin mapping |
| 32 | PA28SO1-15B-6 | MS-013-variant | 1.27mm | 9.00mm | 11.6mm | 28 | 28 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, variant, .354 SOIC-28, 1:1 pin mapping |
| 33 | PA28-SO-652D-6 | MS-013 | 1.27mm | 7.5mm | 10.57mm | 28 | 28 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-28, 1:1 pin mapping |
| 34 | PA32SO1-OT | MS-013-wide | 1.27mm | 11.4mm | 14.1mm | 32 | 32 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13-wide, .448 SOIC-32, 1:1 pin mapping |
| 35 | PA32-SO-652D-3 | MS-013 | 1.27mm | 7.5mm | 10.57mm | 32 | 32 | Open Top | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-32, 1:1 pin mapping |
| 36 | PA40SO1-OT | MS-013-wide | 1.27mm | 11.4mm | 14.1mm | 40 | 40 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-13-wide, .448 SOIC-40, 1:1 pin mapping |
| 37 | PA44SO1-OT | MS-013-Oversized | 1.27mm | 13.3mm | 16.00mm | 44 | 44 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-13-Oversized, .523 SOIC-44, 1:1 pin mapping |
| 38 | PA12C-2006-S4 | MS-012-Variant | 1.27mm | 5.3mm | 7.8mm | 8 | 18 | Clamshell | 0.600" | 1:1 | Microchip 12CXXX/dataman S4 Programmer |
| 39 | PA8SO1-03-1-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 8 | 8 | Clamshell | 0.300" | 1:1 | Microchip 93C06/46X |
| 40 | PA8SO1-05-2-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 8 | 8 | Clamshell | 0.300" | 1:1 | Microchip 93C06/46X |
| 41 | PA14-08-1-1603-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 14 | 8 | Open Top | 0.600" | 1:1 | National/Fairchild: NM93C56/ C66 |
| 42 | PA14SD-05H-8D6-1 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 14 | 8 | Clamshell | 0.600" | 1:1 | See Datasheet |
| 43 | PA16SO-8-1-3 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 16 | 8 | Open Top | 0.300" | 1:1 | Xicor X24128 |
| 44 | PA16SO-8-1-6 | MS-012 | 1.27mm | 3.9mm | 6.0mm | 16 | 8 | Open Top | 0.600" | 1:1 | Xicor X24128 |
| 45 | PA18SO1-BP54 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 18 | 28 | Clamshell | 0.600" | 1:1 | Microchip PIC16C54 & PIC16C56/BP Microsystems CP1128 programmer. |
| 46 | PA20-08-2-2808-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 8 | Clamshell | 0.300" | 1:1 | Atmel, AT17C65, 17C128, 17C256 |
| 47 | PA20-08-5-2808-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 8 | Clamshell | 0.300" | 1:1 | Xilinx, XC1701(L)(P), XC17512L |
| 48 | PA20-20-5-2808-3 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 20 | Clamshell | 0.600" | 1:1 | |
| 49 | PA5114-20SO | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 40 | Clamshell | 0.600" | 1:1 | Atmel: AT89C5114, AT89C5116 |
| 50 | PA20-08-2-2808-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 8 | Clamshell | 0.600" | 1:1 | Atmel, AT17C65, 17C128, 17C256 |
| 51 | PA20-08-5-2808-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 8 | Clamshell | 0.600" | 1:1 | Xilinx, XC1701(L)(P), XC17512L |
| 52 | PA20-20-5-2808-6 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 20 | 20 | Clamshell | 0.600" | 1:1 | Atmel AT89C1051, AT89C2051 |
| 53 | PA20-SO-652D-6 | MS-013 | 1.27mm | 7.5mm | 10.57mm | 20 | 20 | Clamshell | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-20, 1:1 pin mapping |
| 54 | PA28SO1-BP55 | MS-013 | 1.27mm | 7.5mm | 11.6mm | 28 | 28 | Clamshell | 0.600" | 1:1 | Microchip PIC16C55, PIC16C57, 27C128, 27C256, 27C512, 27C64, 28C16A |
| 55 | PA51CC2-SD | MS-013 | 1.27mm | 7.5mm | 11.6mm | 28 | 40 | Clamshell | 0.600" | 1:1 | Atmel, T89C51CC02 |
| 56 | PA32-SO-652D-6 | MS-013 | 1.27mm | 7.5mm | 10.57mm | 32 | 32 | Open Top | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-32, 1:1 pin mapping |
| 57 | PA34-32-1SP6 | MS-013-wide | 1.27mm | 11.4mm | 14.1mm | 34 | 32 | Open Top | 0.600" | 1:1 | N/A |
| 58 | PA29F-S4-SO1-OT | MS-013-Oversized | 1.27mm | 13.3mm | 16.00mm | 44 | 32 | Clamshell | 0.600" | 1:1 | AMD 29F200, 29F400,29F800 |
| 59 | PA44-42-02-SO03-6 | MS-013-Oversized | 1.27mm | 13.3mm | 16.00mm | 44 | 42 | Open Top | 0.600" | 1:1 | ST Micro 27C800 and OKI Semi MSM27C1652CZ |
| 60 | PA29F-46SON-OT | MO-220 | 0.50mm | 10.00mm | 10.10mm | 46 | 44 | Open Top | 0.600" | 1:1 | Fujitsu MBM29LV800T |
SMT & Production SOIC to DIP Adapters
SMT SOIC to DIP adapters are designed for permanent solder-down installation in production assemblies, embedded systems, prototyping, and engineering validation. These adapters provide a reliable method of integrating SOIC devices into standard DIP footprints where repeated device removal is not required.
| Order | P/N | Supported Device Jedec STD. | SOIC Pitch (mm) | Top Pins (SOIC) | Bottom Pins (DIP) | DIP Span (inches) | Wiring | Supported Devices |
|---|---|---|---|---|---|---|---|---|
| 1 | PA-SOD3SM18-08 | MS-012 | 1.27mm | 8 | 8 | 0.300" | 1:1 | Generic — JEDEC MS-12-150 SOIC-8, 1:1 pin mapping |
| 2 | PA-SOD3SM18-14 | MS-012 | 1.27mm | 14 | 14 | 0.300" | 1:1 | Generic — JEDEC MS-12-150 SOIC-14, 1:1 pin mapping |
| 3 | PA-SOD3SM18-16 | MS-012 | 1.27mm | 16 | 16 | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-16, 1:1 pin mapping |
| 4 | PA-SOD3SM18-18 | MS-013-variant | 1.27mm | 18 | 18 | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-18, 1:1 pin mapping |
| 5 | PA-SOD3SM18-20 | MS-013-variant | 1.27mm | 20 | 20 | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-20, 1:1 pin mapping |
| 6 | PA-SOD3SM18-24 | MS-013-variant | 1.27mm | 24 | 24 | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-24, 1:1 pin mapping |
| 7 | PASOD6SM18-24 | MS-013 | 1.27mm | 24 | 24 | 0.300" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-20, 1:1 pin mapping |
| 8 | PA-SOD3SM18-28 | MS-013-variant | 1.27mm | 28 | 28 | 0.300" | 1:1 | Generic — JEDEC MS-13, variant, .331 SOIC-28, 1:1 pin mapping |
| 9 | PA-SOD6SM18-28 | MS-013 | 1.27mm | 28 | 28 | 0.600" | 1:1 | Generic — JEDEC MS-13, .300 SOIC-28, 1:1 pin mapping |
| 10 | PA-SOD6SM18-32 | MS-013-wide | 1.27mm | 32 | 32 | 0.600" | 1:1 | Generic — JEDEC MS-13-wide, .448 SOIC-32, 1:1 pin mapping |
| 11 | PA-SOD6SM18-40 | MS-013-wide | 1.27mm | 40 | 40 | 0.600" | 1:1 | Generic — JEDEC MS-13-wide, .448 SOIC-40, 1:1 pin mapping |
| 12 | PA-SOD6SM18-44 | MS-013-Oversized | 1.27mm | 44 | 44 | 0.600" | 1:1 | Generic — JEDEC MS-13-Oversized, .523 SOIC-44, 1:1 pin mapping |
Need a Custom SOIC to DIP Adapter?
Adapt-Plus designs custom SOIC to DIP adapters for applications that require non-standard pin counts, specialized footprints, custom pin mappings, or unique mechanical and electrical interface requirements. We work with engineering teams to develop adapter solutions for devices that are not supported by standard catalog products.
Custom adapters are available for firmware programming, engineering validation, functional testing, prototyping, production programming, and other application-specific requirements.