SOIC-16 to DIP-16 Programming Adapter — Open Top Socket, 0.600″ DIP Span

Overview

PA16SO1-03-6 is a device-specific programming adapter designed for JEDEC MS-012 compliant SOIC-16 devices, converting a SOIC-16 package into a DIP-16 footprint for programming and test applications.

Interface

• Top interface: SOIC-16, 1.27 mm pitch
• Bottom interface: DIP-16, 0.600″ span
• Device body size: 3.9 × 3.9 mm
• Tip-to-tip dimensions: 6.0 × 6.0 mm

Key Features

• Open top socket for quick device insertion and removal
• 1:1 wiring for direct pin mapping
• Suitable for general-purpose programming applications

Compatibility

Generic — JEDEC MS-012 SOIC-16, 1:1 pin mapping

Technical Specifications

• Pitch: 1.27 mm
• Device body size (X × Y): 3.9 × 3.9 mm
• Tip-to-tip size: 6.0 × 6.0 mm
• Top interface pin count: 16
• Bottom interface pin count: 16
• Socket type: Open Top
• Wiring type: 1:1
• Supported devices: Generic — JEDEC MS-012 SOIC-16, 1:1 pin mapping