SOIC-16 to DIP-16 Programming Adapter — Clamshell Socket, 0.600″ DIP Span

Overview

PA16SO1-08H-6 is a device-specific programming adapter designed for JEDEC MS-013 compliant SOIC-16 devices, converting a SOIC-16 package into a DIP-16 footprint for programming and test applications.

Interface

• Top interface: SOIC-16, 1.27 mm pitch
• Bottom interface: DIP-16, 0.600″ span
• Device body size: 7.5 × 7.5 mm
• Tip-to-tip dimensions: 11.6 × 11.6 mm

Key Features

• Clamshell socket for secure device insertion and removal
• 1:1 wiring for direct pin mapping
• Designed for repeatable programming and handling reliability

Compatibility

Generic — JEDEC MS-013 SOIC-16, 1:1 pin mapping

Technical Specifications

• Pitch: 1.27 mm
• Device body size (X × Y): 7.5 × 7.5 mm
• Tip-to-tip size: 11.6 × 11.6 mm
• Top interface pin count: 16
• Bottom interface pin count: 16
• Socket type: Clamshell
• Wiring type: 1:1
• Supported devices: Generic — JEDEC MS-013 SOIC-16, 1:1 pin mapping