SOIC-14 to DIP-14 Programming Adapter — Clamshell Socket, 0.600″ DIP Span

Overview

PA14SO1-08H-6 is a device-specific programming adapter designed for JEDEC MS-013 compliant SOIC-14 devices, converting a SOIC-14 package into a DIP-14 footprint for programming and test applications.

Interface

• Top interface: SOIC-14, 1.27 mm pitch
• Bottom interface: DIP-14, 0.600″ span
• Device body size: 3.9 × 3.9 mm
• Tip-to-tip dimensions: 6.0 × 6.0 mm

Key Features

• Clamshell socket for secure device insertion and removal
• 1:1 wiring for direct pin mapping
• Designed for repeatable programming and handling reliability

Compatibility

Generic — JEDEC MS-013 SOIC-14, 1:1 pin mapping

Technical Specifications

• Pitch: 1.27 mm
• Device body size (X × Y): 3.9 × 3.9 mm
• Tip-to-tip size: 6.0 × 6.0 mm
• Top interface pin count: 14
• Bottom interface pin count: 14
• Socket type: Clamshell
• Wiring type: 1:1
• Supported devices: Generic — JEDEC MS-013 SOIC-14, 1:1 pin mapping

ber: PA14SO1-08H-6

• Top Interface: 14-pin SOIC
• Bottom Interface: DIP
• Top Pin Count: 14
• Row Spacing: 300 mil
• Pin Mapping: 1:1