SOIC-18 to DIP-18 Programming Adapter — Clamshell Socket, 0.300″ DIP Span

Overview

PA18SO1-06H-3 is a device-specific programming adapter designed for JEDEC MS-013 compliant SOIC-18 devices, converting a SOIC-18 package into a DIP-18 footprint for programming and test applications.

Interface

• Top interface: SOIC-18, 1.27 mm pitch
• Bottom interface: DIP-18, 0.300″ span
• Device body size: 8.4 × 8.4 mm
• Tip-to-tip dimensions: 12.0 × 12.0 mm

Key Features

• Clamshell socket for secure device insertion and removal
• 1:1 wiring for direct pin mapping
• Designed for repeatable programming and handling reliability

Compatibility

Generic — JEDEC MS-013 SOIC-18, 1:1 pin mapping

Technical Specifications

• Pitch: 1.27 mm
• Device body size (X × Y): 8.4 × 8.4 mm
• Tip-to-tip size: 12.0 × 12.0 mm
• Top interface pin count: 18
• Bottom interface pin count: 18
• Socket type: Clamshell
• Wiring type: 1:1
• Supported devices: Generic — JEDEC MS-013 SOIC-18, 1:1 pin mapping