Overview

Adapters-Plus IC Test Socket Solutions provide stable, repeatable electrical contact for device validation, characterization, and screening workflows. This page is intended to help engineers identify the most appropriate socket platform for their application by organizing solutions by test intent—high-cycle contactor sockets versus footprint-matched production sockets—so selection can be made without ambiguity.

Applications

• Manual test and engineering bring-up
• Inspection and failure analysis
• Test socket characterization
• Production screening and repeated insert/remove workflows
• Environmental and reliability testing (HAST, HTOL, LTOL)

Applicable to spring-pin contactor platforms.

Spring-Pin (Contactor) Test Sockets — High-Cycle

A versatile, high-cycle platform using spring-pin contacts and controlled actuation for repeatable probing
across many IC package styles.

• Supports BGA, LGA, QFN, QFP, SOP, and other packages
• Fine pitch support down to 0.30 mm (application-dependent)
• Multiple actuation options
• Built-to-order alignment and contact performance

BL / LL Series BGA & LGA Sockets — Production Test

Footprint-compatible sockets designed to mount directly to existing BGA/LGA PCB layouts
for rapid setup and repeatable production testing.

• Common pitches: 0.80 mm, 1.00 mm, 1.27 mm
• Supports hundreds of device footprints
• Clearance-friendly configurations
• Optional BL + FBS modular stacking

Important: Not intended for burn-in.

Quick Selection Guide

• High cycle life or burn-in required → Spring-Pin Test Sockets
• Preserve existing BGA/LGA footprint → BL/LL Series
• Dense PCB layouts → BL + FBS modular approach

Need Technical Guidance?

If you don’t see a clear match for your device, our engineering team can recommend a best-fit
configuration or design a custom solution based on your package and test requirements.