BL / LL Series BGA & LGA Test Sockets
Mount directly to existing PCB land patterns for development and production test.
Overview and Supported Configurations
BL / LL Series BGA and LGA sockets support a broad range of device footprints—from low
pin-count packages to arrays exceeding 1,000 contacts—while maintaining direct
compatibility with existing PCB land patterns.
Standard configurations support 0.80 mm, 1.00 mm, and 1.27 mm pitches. Because
these sockets are built to order, mechanical clearance, tail style, and footprint details
can be matched precisely to the board already in use.
Mounting and Clearance Options
Mounting & Clearance Options
Surface Mount (SMT)
Direct SMT mounting to an existing BGA footprint for low-profile applications.
Typical clearance above PCB: ~0.060″
Through-Hole with FBS
Two-piece configuration using a BL Series socket mated to an FBS female BGA adapter for increased clearance on dense PCB layouts. Typical clearance above PCB: ~0.130″ Expandable with optional female-to-male adapters (~0.130″ per adapter)
Features & Benefits
- Footprint Compatibility: Designed to mount directly to existing BGA and LGA land patterns.
- Development Through Production Test: Common socket architecture supports use from bench validation to production test.
- Built to Order: Mechanical configuration and footprint details tailored to the target PCB.
Note: To avoid interference with nearby passive components, the socket body
may extend beyond the device footprint by approximately 0.040″, depending on configuration.
Typical Performance Specifications
Electrical
- Max Voltage: 75 VAC / 100 VDC
- Max Current: 1.0 A per contact
- Contact Resistance: 0.01 Ω max
- Insulation Resistance: 10,000 MΩ min @ 500 VDC
- Capacitance: 1 pF max
- Self Inductance: 2 nH max
Thermal
- Operating Temperature: -55°C to 140°C
- Resistance to Soldering Heat: 10 seconds @ 288°C
- Flammability Rating: UL94V-0
Materials
- Contacts: Brass Alloy C36000 (ASTM-B16), 1/2 Hard
- Insulator: FR4-G10
Need Technical Guidance?
Share your BGA or LGA package drawing along with board constraints such as keep-out zones,
height limits, or nearby components. Please include pitch, ball or land count, and the
preferred mounting or clearance approach.
