BL / LL Series BGA & LGA Production Test Sockets
Footprint-compatible BGA and LGA test sockets.
Mount directly to existing PCB land patterns for development and production test.
BL / LL Series BGA & LGA Sockets for Prototyping & Testing
The BL / LL Series BGA and LGA sockets support a wide range of device footprints—from low pin counts to arrays exceeding 1,000 contacts—while maintaining compatibility with existing PCB layouts.
Standard offerings support 0.80 mm, 1.00 mm, and 1.27 mm pitch configurations. Because these sockets are built to order, mechanical clearance, tail style, and footprint details can be matched to the board you already have in hand.
MOUNTING & CLEARANCE OPTIONS
Surface Mount (SMT)
Direct SMT mounting to an existing BGA footprint for low-profile applications.
Typical clearance above PCB: ~0.060″
Through-Hole with FBS
Two-piece configuration using a BL Series socket mated to an FBS female BGA adapter for increased clearance on dense PCB layouts.
Typical clearance above PCB: ~0.130″
Expandable with optional female-to-male adapters (~0.130″ per adapter)
Features & Benefits
- Footprint Compatibility: Designed to fit existing BGA/LGA land patterns.
- Development to Production Test: Same socket concept from bench to production.
- Built to Order: Tailored mechanical and footprint details.
Note: To avoid interference with nearby passives, the socket body may extend beyond the device footprint by approximately 0.040″ (configuration dependent).
BL/LL vs. Spring-Pin Test Sockets
If your device is a BGA/LGA and you’re deciding between socket types, these quick guidelines can help:
- Choose BL/LL BGA & LGA Production Test Sockets when you need footprint compatibility, a compact locking socket format, or a socket that drops into an existing layout.
- Choose Spring-Pin (Contactor) Test Sockets when you need higher insertion cycles, compliance for coplanarity variation, or configurable actuation for repeated test setups.
Typical Performance Specifications
Electrical
- Max Voltage: 75 VAC / 100 VDC
- Max Current: 1.0 A per contact
- Contact Resistance: 0.01 Ω max
- Insulation Resistance: 10,000 MΩ min @ 500 VDC
- Capacitance: 1 pF max
- Self Inductance: 2 nH max
Thermal
- Operating Temperature: -55°C to 140°C
- Resistance to Soldering Heat: 10 seconds @ 288°C
- Flammability Rating: UL94V-0
Materials
- Contacts: Brass Alloy C36000 (ASTM-B16), 1/2 Hard Insulator: FR4-G10
Need Technical Guidance?
Send your BGA or LGA package drawing along with board constraints such as keep-out zones,
height limits, or nearby components. Specify pitch, ball or land count, and preferred
mounting or clearance approach.
