Spring-Pin (Contactor) IC Test Sockets
Overview
Spring-pin (contactor) IC test sockets are designed for high-cycle electrical testing of integrated
circuits during development, validation, and reliability testing.
These sockets use precision spring-pin contacts to accommodate coplanarity variation and repeated
insertions, making them well suited for burn-in, HAST, HTOL, and other demanding test environments.
Custom Spring-Pin Socket Configurations
Spring-pin contactor test sockets are configured specifically for each device and test environment.
If your application requires high insertion cycles, compliance for coplanarity variation, or controlled
electrical performance during ATE, burn-in, or characterization, our engineering team can help.
Engineered Contact Interface
Spring-pin test socket performance is defined at the contact interface. Rather than applying a
one-size-fits-all approach, each socket is engineered around the electrical, mechanical, and
environmental requirements of the device under test.
Designs draw from an internal library of spring-pin (pogo-pin) geometries, materials, and electrical
variants. This allows contact compliance, force, bandwidth, and durability to be tuned as part of a
single, integrated socket solution, ensuring consistent electrical performance across demanding
test environments.
Depending on the device package and test conditions, socket designs may incorporate:
- Single-ended or double-ended spring pins
- Ultra-fine pitch pins for dense layouts
- Kelvin (4-wire) pins for precision measurement
- High-frequency pins optimized for signal integrity
- Non-magnetic pins for sensitive applications
Pin parameters such as barrel diameter, travel, tip geometry, spring force, and plating are selected
as part of the overall socket engineering process and are not specified or supplied as standalone
components.
Supported IC Package Types
Spring-pin socket platforms support a wide range of surface-mount and array-based IC packages,
including:
- BGA and LGA
- QFN and DFN
- QFP and TQFP
- SOIC, SOP, SSOP, and TSSOP
Custom and non-standard packages are supported through tailored pin layouts, retention design,
and fixture-specific interface strategies.
Pin counts range from low-I/O devices to high-density arrays. Fine-pitch layouts and mixed-signal
designs are accommodated through appropriate pin selection and layout strategy.
Spring-Pin Test Socket Base Platforms
To balance customization with lead time and cost, most spring-pin test sockets are built on one of
three standardized base platforms. Each base provides a mechanical foundation for custom pin fields,
retention methods, and actuation features.
Base 100 — Compact Platform
- Body size: approximately 25 × 34 mm
- Supports devices up to approximately 14 × 14 mm
- Optimized for small QFN, QFP, and compact BGA packages
Base 200 — Mid-Size Universal Platform
- Body size: approximately 40 × 50 mm
- Supports devices up to approximately 24 × 24 mm
- Common choice for development fixtures and ATE environments
Base 300 — Large / High-I/O Platform
- Body size: approximately 50 × 61 mm
- Supports devices up to approximately 34 × 34 mm
- Designed for large BGAs and higher pin-count devices
Customization & Mechanical Options
Spring-pin test sockets are configured to match device handling requirements, fixture constraints,
and environmental conditions. Common customization options include:
- Clamshell, bottle-cap, and top-load retainer styles
- Manual cam locks and rotary locking mechanisms
- Pneumatic or air-cylinder actuation
- Integrated heat sinks and thermal interface features
- Temperature sensors and embedded monitoring features
- Custom mounting patterns and PCB or fixture interfaces
For non-standard packages or tight clearance conditions, retainers and actuation mechanisms can
be designed to fit within the available fixture envelope.
Typical Performance Specifications
Performance characteristics depend on the selected spring-pin type, tip geometry, pitch, and
operating environment. The values below represent typical ranges achieved in Adapters-Plus
spring-pin test socket designs using standard and high-performance pogo-pin configurations.
| Contact Materials | Gold-plated copper alloy or beryllium copper (pin dependent) |
| Socket / Housing Materials | PEI (standard). Alternative high-performance thermoplastics such as PEEK or Torlon may be specified for custom configurations requiring enhanced thermal stability, mechanical strength, or chemical resistance. |
| Current Rating |
Up to 1.0 A continuous per contact |
Applications
- Engineering bring-up and prototyping
- ATE and bench testing
- Inspection and failure analysis
- Burn-in, HAST, and environmental stress testing
- Device characterization and electrical performance measurement
Spring-Pin vs. BGA Locking Sockets
For BGA or LGA devices, the following guidelines can help determine the appropriate socket
technology based on test intent and mechanical constraints:
-
Choose Spring-Pin when high insertion cycles, compliance for coplanarity
variation, or configurable actuation are required. -
Choose BGA Locking Sockets (BL/LL Series) when footprint compatibility,
a compact locking format, or drop-in use with an existing PCB layout is required.
Why Adapters-Plus?
- Engineering-led support to align socket design with your device and fixture needs
- Standard base platforms to reduce lead time and control cost
- Custom options for actuation, thermal management, and sensors
- Built for repeatable testing with stable force and alignment over high insertion cycles
Custom & Technical Guidance
If you don’t see a clear match for your device or test requirements, our engineering team can
review your IC package and recommend the most appropriate spring-pin socket platform and
configuration.
Frequently Asked Questions
What is a spring-pin (pogo-pin) IC test socket?
A spring-pin IC test socket uses spring-loaded contacts to make temporary electrical connections to an IC without soldering.
The compliant contact helps accommodate package coplanarity variation while maintaining consistent electrical performance during repeated insertions.
When should I choose a spring-pin socket instead of a soldered or locking socket?
Spring-pin sockets are typically selected for applications requiring frequent device insertion and removal, tolerance compliance, or flexible test setups.
They are commonly used in engineering validation, ATE, failure analysis, and environmental testing.
For footprint-compatible, low-profile solutions, a locking BGA/LGA socket may be more appropriate.
Do you sell pogo pins as a standalone product?
No. Pogo pins are not sold as individual components.
They are selected and integrated as part of a complete spring-pin test socket design to ensure proper force, alignment, signal integrity, and long-term reliability.
How are spring-pin tip styles selected for an application?
Tip geometry is chosen based on the device termination type, pitch, surface finish, and test requirements.
For example, crown tips are often used for BGA solder balls, while flat or Kelvin tips may be specified for precision measurement or specialized applications.
Tip selection is part of the overall socket engineering process.
What electrical performance can be expected from spring-pin contacts?
Electrical performance depends on pin type and configuration, but spring-pin contacts are commonly designed to support low contact resistance, controlled impedance paths, and multi-GHz signal bandwidth.
For background reference on contact resistance and probe behavior, see:
https://en.wikipedia.org/wiki/Pogo_pin
Are spring-pin sockets suitable for high-frequency or high-speed signals?
Yes, when designed correctly.
High-frequency spring-pin configurations are commonly used in RF and high-speed digital testing, with attention paid to pin geometry, grounding strategy, and signal path length.
General signal integrity considerations are outlined by IPC standards such as:
https://www.ipc.org/standards
What information is needed to quote a custom spring-pin test socket?
To evaluate a socket design, we typically request an IC package drawing, pin count and pitch, test environment details, and any mechanical or thermal constraints.
Providing complete information helps ensure the correct base platform, contact type, and retention method are selected.
