PA-DSO-0803-D250-08/2

PA-DSO-0803-D250-08/2 – 8-Pin 0.3″ DIP LIF Socket to 0.250″ SOIC Plug Adapter (Includes Two Plug Modules)


🧩 Overview

The PA-DSO-0803-D250-08/2 adapter provides a precise and compact interface for converting standard 8-pin 0.3″ (7.62 mm) DIP devices to a 0.250″ (6.35 mm) SOIC plug format.
It is engineered for prototyping, evaluation, and test environments where engineers require easy transitions between through-hole and surface-mount configurations.

Each adapter includes one DIP assembly PCB with a low-insertion-force (LIF) socket and two detachable SOIC plug modules.
Furthermore, additional plug sets are available separately in packs of six, allowing quick changeovers and increased flexibility for repetitive test operations.


⚙️ Technical Specifications

Parameter Specification
Part Number PA-DSO-0803-D250-08/2
Adapter Type DIP to SOIC Plug Adapter
Socket Type 8-pin LIF Socket (0.3″ / 7.62 mm row spacing)
Plug Type 8-pin SOIC Plug (0.250″ / 6.35 mm body width)
Socket Pitch 0.100″ (2.54 mm)
Plug Pitch 0.050″ (1.27 mm)
Wiring Configuration 1:1 Direct Connection
Pin Count 8
Body Style DIP-8 to SOIC-8
Included Plugs 2 × SOIC Plug Modules
Additional Plug Sets Sold separately (Pack of 6)
Mount Type Through-hole to SMT (SOIC)
Operating Temperature −40 °C to +85 °C (typical)
Material FR-4 PCB, Gold-plated Contacts
RoHS Status RoHS Compliant

🌟 Key Features

  • Converts DIP-8 (0.3″) to SOIC-8 (0.250″) effortlessly

  • Includes two plug modules for fast device interchange

  • LIF socket minimizes pin stress during insertion and removal

  • 1:1 wiring maintains electrical precision and signal reliability

  • Gold-plated contacts extend mechanical and electrical life

  • Modular assembly supports repeatable testing and reconfiguration


🔬 Applications

  • IC prototyping and evaluation setups

  • Device programming and reprogramming cycles

  • Conversion from DIP to SOIC layouts on development boards

  • Bench testing and electronic repair tasks

  • Engineering, R&D, and production test environments

Additionally, this adapter simplifies transitions between traditional DIP test sockets and modern SOIC SMT footprints, improving efficiency in lab workflows.


📦 Product Includes


🔗 Compatibility Note

This model provides 1:1 direct wiring between DIP and SOIC pinouts.
It is compatible with JEDEC MS-012 SOIC-8 footprints and 0.3″ DIP-8 socket patterns.
Moreover, additional SOIC plug sets are available under part number PA-DSO-0803-PLUG-SET6.


🧠 Why Choose This Adapter

Because the PA-DSO-0803-D250-08/2 uses precision gold-plated contacts and a modular socket design, it delivers repeatable performance over thousands of cycles.
Therefore, it is ideal for engineers and technicians requiring reliable DIP-to-SOIC conversion in both development and production environments.


⚡ Streamline Your Prototyping Workflow

The PA-DSO-0803-D250-08/2 adapter bridges DIP and SOIC configurations with accuracy and ease.
By reducing soldering time and eliminating lead wear, it enhances test repeatability and workflow efficiency.
As a result, engineers gain a durable, reusable interconnect for rapid evaluation and surface-mount prototyping.

$21.00

Specifications:

Top Pin Count: 8
Bottom Plug Pin Count: 8
Device Lead-Pitch: 0.1"

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