PA-DSO-1403-D250-14/2

The PA-DSO-1403-D250-14/2 adapter kit offers a practical solution for converting a 14-pin, 0.3” wide DIP layout into two surface-mount SOIC connections. Designed for engineers working with small-footprint devices, it simplifies in-system test, development, and emulation.

The kit includes a single DIP base board and two surface-mount plug modules. These SOIC plug boards feature a .250” tip-to-tip width and a 0.050” pitch, making them ideal for soldering directly to standard SOIC pads. Meanwhile, the DIP board supports a 0.100” pitch, aligning with common DIP socket configurations.

Thanks to its narrow-body format, this adapter is suitable for gang-style installation. The included machined LIF socket provides reliable contact without requiring the added space or expense of a ZIF.

🔧 Features – DIP to SOIC Conversion Kit

• Converts standard .3” wide 14-pin DIP to two 14-pin .250” SOIC plugs

• Designed for use with .250” SOIC footprints (0.050” pitch)

• Includes one DIP board and two SOIC plug modules

• Machined-pin LIF socket with 0.018” round pins

• Supports emulation, prototyping, and gang-mount test setups