PA-DSO-1603-D310-16/2
PA-DSO-1603-D310-16/2 – 16-Pin DIP to Dual 16-Pin SOIC Plug Adapter (0.100″ / 0.050″, 0.310″ Lead-Span)
The PA-DSO-1603-D310-16/2 is a 16-pin DIP to dual 16-pin SOIC plug adapter designed to convert
a 0.100″ (2.54 mm) pitch DIP device to two 0.050″ (1.27 mm) SOIC plug modules
with a 0.310″ (7.87 mm) lead-span (tip-to-tip).
The kit includes one DIP base PCB with a low-insertion-force (LIF) socket and two
detachable SOIC plug modules. All connections are wired 1:1
(DIP pin 1 → SOIC pin 1), maintaining direct signal continuity.
The 0.310″ lead-span configuration supports applications requiring additional
clearance between SOIC leads. The narrow-body DIP format allows gang-style
installation in compact test and development environments.
Technical Specifications
| Part Number | PA-DSO-1603-D310-16/2 |
| Top Interface | 16-Pin DIP, 0.100″ (2.54 mm) pitch |
| Bottom Interface | Dual 16-Pin SOIC Plugs, 0.050″ (1.27 mm) pitch |
| SOIC Lead-Span (Tip-to-Tip) | 0.310″ (7.87 mm) |
| Socket Type | Low Insertion Force (LIF) |
| Wiring | 1:1 direct mapping |
| Included Plug Modules | 2 × SOIC-16 Plug Modules |
| Mount Style | Through-hole DIP to SOIC Plug |
| Material | FR-4 PCB, Gold-plated contacts |
| RoHS Status | Compliant |
Applications
Used for DIP-to-SOIC footprint conversion in engineering validation,
firmware emulation, development testing, and surface-mount adaptation.
$27.50





