PA-DSO-1803-D310-18/2 – 18-Pin DIP to Dual 18-Pin SOIC Plug Adapter (.310″ Lead Span, LIF Socket)

The PA-DSO-1803-D310-18/2 converts a standard 18-pin,
0.300″ wide DIP footprint to two 18-pin SOIC surface-mount plug
modules with a 0.310″ lead span (tip-to-tip). This configuration is
commonly used when slightly wider SOIC footprints are required in
test, development, or prototype environments.

The assembly includes a DIP base board with 0.100″ (2.54 mm) pitch and
two SOIC plug modules with 0.050″ (1.27 mm) pitch. All connections are
wired 1:1, preserving direct signal mapping between the
DIP interface and the SOIC plug outputs.

A factory-installed Low Insertion Force (LIF) socket with machined
contacts allows repeatable IC insertion and removal without specialized
tools. The narrow board profile supports side-by-side (gang) mounting
within compact bench setups or fixture environments.

Technical Specifications

Typical Applications

Used for firmware debugging, emulator setups, validation testing,
and development environments where DIP interfaces must connect to
.310″ lead-span SOIC surface-mount footprints.