24-Pin SOIC to 0.6″ DIP Adapter .470” Plug Version – LIF Socket, Compact Format

The 24-Pin SOIC to 0.6″ DIP Adapter .470” Plug Version offers a streamlined way to convert a 24-pin, 0.6” wide DIP layout into two SOIC plug modules. With .470” tip-to-tip spacing, this adapter supports many wider SOIC packages used in prototyping and testing environments.

Each kit includes a DIP base board with 0.100” pitch and two 24-pin SOIC plug modules at 0.050” pitch. These modules are compatible with standard .470” SOIC footprints. A machined-pin LIF socket comes pre-installed to allow fast and easy IC swaps without any tools.

Because this adapter supports gang-style mounting, it is well-suited for side-by-side setups on tight bench layouts. Whether you’re running firmware tests or assembling a temporary prototype, it gives you a quick and effective connection between SOIC devices and DIP boards.

Features – 24-Pin SOIC to 0.6″ DIP Adapter

• Converts 24-pin, 0.6” DIP layout to dual SOIC plug modules
• Supports .470” tip-to-tip SOIC spacing, 0.050” pitch
• 0.100” DIP pitch for through-hole compatibility
• Includes plug modules, DIP base board, and LIF socket
• No tools needed for IC insertion or removal
• Ideal for gang testing and dense test setups
• Supports firmware development and functional testing