24-Pin SOIC to 0.6″ DIP Adapter .560” Plug Version – LIF Socket, Compact Format

The 24-Pin SOIC to 0.6″ DIP Adapter .560” Plug Version simplifies the process of adapting surface-mount devices to DIP test environments. It converts a 24-pin, 0.6” wide DIP footprint into two SOIC plug modules spaced at .560” tip-to-tip.

This kit includes a DIP base board with 0.100” pitch and two 24-pin SOIC plug modules at 0.050” pitch. These modules are compatible with standard .560” SOIC footprints. A machined-pin LIF socket is pre-installed, enabling tool-free IC handling.

The adapter’s layout supports compact placement for gang testing and side-by-side setups. Whether you’re conducting early-stage firmware testing or building a prototype, this adapter offers a reliable and efficient solution.

Features – 24-Pin SOIC to 0.6″ DIP Adapter

• Converts 24-pin 0.6” DIP to dual SOIC plug modules
• Supports .560” SOIC spacing with 0.050” pitch
• 0.100” pitch DIP layout for through-hole soldering
• Kit includes plug modules, LIF socket, and base board
• No tools required for IC swaps
• Compatible with compact and gang-style configurations
• Great for prototyping, debugging, or low-volume testing