PA-DSO-2806 – 28-Pin DIP to SOIC Plug Adapter Board (Top Board Only, 0.600″ / 0.050″)

The PA-DSO-2806 is a 28-pin DIP to SOIC plug adapter
top board only, designed for use within existing
Adapters-Plus DIP to SOIC plug adapter systems. This version provides
a wider 0.600″ DIP footprint for applications requiring increased
row spacing or additional layout clearance.

The top interface supports a 28-pin DIP configuration with
0.100″ (2.54 mm) pitch spacing and 0.600″ row spacing.
The bottom interface mates with 0.050″ (1.27 mm) pitch SOIC plug
modules used in the PA-DSO series. All connections are wired
1:1, maintaining direct signal continuity between
DIP and SOIC interfaces.

A factory-installed Low Insertion Force (LIF) socket supports repeated
IC insertion and removal while preserving contact integrity.
This board is typically ordered as a replacement component or as an
additional top board to expand modular adapter configurations.

Note: SOIC surface-mount plug modules are not included
and must be ordered separately.

Technical Specifications

Typical Use

Used as a replacement or expansion board within existing DIP to SOIC
plug adapter assemblies. The 0.600″ DIP width provides additional
spacing for thermal management or board layout flexibility in
development and light production environments.