PA-DSO-2806-D560-28/2
PA-DSO-2806-D560-28/2 – 28-Pin DIP to Dual 28-Pin SOIC Plug Adapter (0.100″ / 0.050″, 0.560″ Lead-Span)
The 28 Pin DIP to SOIC Adapter .560 Plug, part number
PA-DSO-2806-D560-28/2, converts a 28-pin
0.100″ (2.54 mm) pitch, 0.600″ wide DIP device to two 28-pin SOIC
surface-mount plug modules with a 0.560″ (14.22 mm) lead-span (tip-to-tip).
The kit includes one DIP base PCB with a Low Insertion Force (LIF)
socket and two detachable SOIC plug modules with 0.050″ (1.27 mm) pitch.
All connections are wired 1:1 (DIP pin 1 → SOIC pin 1),
maintaining direct signal continuity between DIP and SOIC interfaces.
The 0.600″ DIP format provides increased row spacing for thermal
management and fixture clearance while supporting gang-style installation
in engineering validation and test platforms. Machined-pin contacts ensure
repeatable IC insertion cycles and stable electrical performance.
Technical Specifications
| Part Number | PA-DSO-2806-D560-28/2 |
| Top Interface | 28-Pin DIP, 0.600″ row spacing, 0.100″ (2.54 mm) pitch |
| Bottom Interface | Dual 28-Pin SOIC Plugs, 0.050″ (1.27 mm) pitch |
| SOIC Lead-Span (Tip-to-Tip) | 0.560″ (14.22 mm) |
| Socket Type | Low Insertion Force (LIF) |
| Wiring | 1:1 direct mapping |
| Included Plug Modules | 2 × SOIC-28 Plug Modules |
| Mount Style | Through-hole DIP to SOIC Plug |
| Material | FR-4 PCB, Gold-plated contacts |
| RoHS Status | Compliant |
Applications
Used for DIP-to-SOIC footprint conversion in development, evaluation,
firmware validation, and modular fixture environments requiring
0.560″ lead-span SOIC plug modules with 0.600″ DIP spacing.
$37.00



