PA-SOF-D310-08/6 – 8-Pin SOIC Plug Modules (0.310″ Lead-Span, 6-Pack)

The PA-SOF-D310-08/6 is a six-pack of 8-pin SOIC plug
modules designed for modular SOIC-to-DIP adapter systems. Each plug
supports a 0.310″ (7.87 mm) lead-span (tip-to-tip) SOIC footprint and
is intended for use with compatible PA-DSO series DIP adapter boards.

Each module features 0.050″ pitch (header-top) contacts
for connection to the DIP adapter board and 0.050″ SOIC pitch
(SMT-bottom) for direct soldering to standard SOIC PCB
footprints. Gold-plated contacts provide reliable electrical performance
and repeatable insertion cycles.

The molded housing ensures durability in development and test
environments where repeated installation and removal are required.
This configuration is commonly used for prototyping, emulation,
and fixture-based validation setups.

Note: This listing includes six SOIC plug modules only.
Top adapter boards (PA-DSO series) are sold separately.

Technical Specifications

Applications

Used with PA-DSO series DIP adapter boards for modular SOIC-to-DIP
conversion in engineering validation, firmware development,
and surface-mount emulation environments.