PA-TSD6SM18-32

Overview

The PA-TSD6SM18-32 is an SMT-to-thru-hole adapter designed for TSOP devices with 14 mm and 20 mm body widths.
It allows surface-mount TSOP devices to be used in DIP sockets, breadboards, and test fixtures, making it ideal for development, programming, and evaluation applications.

Key Features

• Supports 14 mm and 20 mm TSOP packages

• SMT land pattern (bottom) to DIP thru-hole pins (top)

• Fixed wiring: DIP 1 → TSOP 9, DIP 2 → TSOP 10, etc.

• Compatible with standard DIP sockets

• FR-4 construction with robust plated thru-hole pins

• Built-to-order for reliable fit and performance

Electrical & Thermal

• Max Voltage: 75 VAC / 100 VDC

• Max Current: 1 A

• Contact Resistance: 0.01 Ω max

• Insulation Resistance: 10,000 MΩ min @ 500 VDC

• Capacitance: 1 pF max

• Self-Inductance: 2 nH max

• Operating Temperature: -55 °C to +140 °C

• Soldering Resistance: 10 s @ 288 °C

• Flammability: UL94 V-0

Materials

• Contacts: Brass Alloy C36000, ½-Hard (ASTM-B16)

• Insulator: FR-4 / G-10

Typical Applications

• TSOP device prototyping

• Programming and validation

• Engineering evaluation

• Low-volume production support

Ordering Information

• Part Number: PA-TSD6SM18-32

• Build Type: Built-to-order

• Typical Lead Time: 2–4 weeks

• Notes: IC package drawing recommended with quote requests