Test & Burn-In Sockets
Spring Pin Test Sockets and BL/LL Series BGA/LGA sockets for lab and production environments.
Overview
Adapters-Plus Test & Burn-In Sockets provide stable, repeatable electrical contact for device validation, characterization, and long-duration reliability testing. Our socket families support high-cycle use in lab, qualification, and production environments—covering common package styles as well as custom footprints when your device requires it.
Applications
- Manual test and engineering bring-up
- Inspection and failure analysis
- Test socket characterization
- Production screening and repeated insert/remove workflows
- Burn-in and environmental stress testing (HAST, HTOL, LTOL)
Examples of Test & Burn in Sockets
Spring Pin Test Sockets
BL / LL BGA Test Sockets
Test & Burn-In Socket Categories
Spring Pin Test Sockets
Our Spring Pin Test Socket Series is a versatile platform designed to support many IC package styles using durable spring-pin contacts and a secure clamshell for consistent alignment. Three standard body sizes cover devices up to 34 x 34 mm, with custom solutions available for larger or specialized requirements.
- Supports many package styles (including BGA, LGA, QFN, QFP, SOP, and more)
- Lead pitches as small as 0.3 mm
- Options to match your workflow: standard clamshell, rotary lock (knob or lever), air cylinder, or heat sink
- Electrical performance options for demanding test needs (including high-frequency use cases)
- Built to order for best-fit device alignment and contact performance
BGA Sockets (BL/LL Series)
The BL/LL Series is designed for BGA and LGA packages with common pitches (0.80 mm, 1.00 mm, and 1.27 mm) and is engineered to fit directly onto existing BGA footprints. This footprint-compatible approach helps avoid PCB layout changes, making it ideal for rapid prototyping, development, and production testing.
- Fits existing BGA footprints for fast setup
- Supports hundreds of device footprints—from small arrays to 1000+ contacts
- Two standard pin-tail options, plus clearance-friendly configurations for populated boards
- Two-piece high-density option: Through-Hole BL Series socket mated to FBS female BGA socket for added PCB clearance
- Built to order with typical lead times of 2–4 weeks
Quick Selection Guide
- Need broad package compatibility or flexible mechanical options? Choose Spring Pin Test Sockets.
- Need to match an existing BGA/LGA footprint without redesigning your PCB? Choose BL/LL Series BGA/LGA Sockets.
- Need additional board clearance on dense layouts? Ask about BL Series + FBS Series modular stacking options.
What to Send for a Fast Quote
- Device package drawing (pin/ball layout, pitch, body size)
- Package type (BGA, LGA, QFN, QFP, SOP, etc.) and pin/ball count
- Test type (manual test, production, burn-in, HAST, HTOL, LTOL)
- Operating temperature range and any thermal constraints (heat sink / airflow needs)
- Fixture constraints (height limits, surrounding components, keep-outs)
- Estimated cycle count / insertion frequency
Need a Custom Test or Burn-In Socket?
If you don’t see a match for your device, we can recommend a best-fit configuration or design a custom solution. Send your package drawing and test requirements and our team will respond with the most practical socket approach for your application.
Request a Quote or Engineering Review
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