SMT SSOP & TSSOP to DIP Adapters
Adapt SSOP and TSSOP surface-mount devices to DIP through-hole footprints with common 0.65 mm pitch compatibility.
Overview
SMT SSOP and TSSOP to DIP adapters interface SSOP and TSSOP surface-mount devices to DIP through-hole footprints used in test fixtures and production replacement
applications.
These adapters support common SSOP and TSSOP packages with a 0.65 mm lead pitch. The primary variation between SSOP and TSSOP packages is body width, while package thickness does not affect adapter compatibility.
The adapters provide a direct electrical and mechanical transition between small-outline SMT packages and DIP layouts without requiring modification to the target PCB or fixture.
These adapters are part of the Production Replacement Adapters product family.
How to Choose the Correct Solution
- Pin count: Must match the device lead count
- Package style: SSOP or TSSOP
- DIP span: 300 mil or 600 mil, based on the target footprint
- Mechanical constraints: Confirm clearance and any nearby components
If the device package is non-standard or does not fall within common SSOP or
TSSOP definitions, provide the package drawing for engineering review.
SMT to Through-Hole Adapters for SSOP & TSSOP to DIP
| Pins | Wiring | 300 mil Span DIP Plug | 600 mil Span DIP Plug |
|---|---|---|---|
| 8 | 1:1 | PA-SSD3SM18-08 | n/a |
| 14 | 1:1 | PA-SSD3SM18-14 | n/a |
| 16 | 1:1 | PA-SSD3SM18-16 | n/a |
| 18 | 1:1 | PA-SSD3SM18-18 | n/a |
| 20 | 1:1 | PA-SSD3SM18-20 | n/a |
| 24 | 1:1 | PA-SSD3SM18-24 | PA-SSD6SM18-24 |
| 28 | 1:1 | PA-SSD3SM18-28 | PA-SSD6SM18-28 |
| 32 | 1:1 | n/a | PA-SSD6SM18-32 |
| 40 | 1:1 | n/a | PA-SSD6SM18-40 |
Custom & Technical Guidance
If your device uses a non-standard SSOP or TSSOP package, has unique mechanical constraints, or requires a configuration not shown, a custom solution is available. Provide the device package drawing and application details so an engineer can review the requirements and recommend an existing option or define a custom adapter.
