SOT23 to DIP Programming Adapters
0.95 mm pitch SOT23 to 0.100″ DIP interface.
Technical Overview
SOT23 to DIP programming adapters provide a defined electrical and mechanical interface between 0.95 mm pitch SOT23 packages and standard 0.100″ (2.54 mm) pitch DIP programming sockets.
The top interface consists of a SOT23 socket or contact footprint selected by package variant (e.g., SOT23-3, SOT23-5, SOT23-6, SOT23-8). The bottom interface presents a DIP plug configured for the required pin count and row spacing (typically 0.300″).
Routing may be configured as direct 1:1 pin mapping or device-specific mapping when required by the programming system. Any reassignment or pin omission is implemented strictly per defined pinout requirements.
- Package pitch: 0.95 mm
- Common variants: SOT23-3, -5, -6, -8
- DIP pitch: 0.100″ (2.54 mm)
- Typical DIP row spacing: 0.300″
Mechanical Configuration
SOT23 to DIP programming adapters are defined by the mechanical dimensions of the SOT23 package and the required DIP footprint. Proper contact alignment depends on accurate lead pitch, body size, and pin count.
- Top Interface (SOT23): 0.95 mm pitch with defined body length, width, and total lead count (3, 5, 6, or 8 leads).
- Contact Method: Open-top or clamshell style socket depending on insertion frequency and lead count.
- Orientation: Pin-1 identification and silkscreen reference to prevent rotation errors.
- Bottom Interface (DIP): 0.100″ pitch plug with specified pin count and 0.300″ row spacing (standard).
- Pin Style: Square post or machine pin based on mating socket requirements.
- Assembly Height: Overall height must match the destination programmer or fixture clearance.
Provide the IC mechanical drawing including body dimensions, pitch, and tolerances to ensure correct socket selection and fit.
Routing Configurations
Routing defines the electrical mapping between the SOT23 top interface and the DIP bottom interface. The configuration is determined by the required DIP pinout used by the programming system.
- 1:1 Mapping: SOT23 lead numbers correspond directly to the matching DIP pin numbers when the DIP format reflects the native device numbering.
- Device-Specific Mapping: Leads are reassigned to match a defined DIP footprint required by the programmer.
- Pin Skips: Unused leads remain unconnected when defined by the device specification.
- Power and Ground Handling: Supply and ground pins are routed per device requirements.
For device-specific configurations, provide the target device reference and required DIP pinout definition.
SOT23 to DIP Programming Adapter Catalog
The following catalog lists standard SOT23 to DIP programming adapter configurations defined by SOT23 lead count, DIP format, socket type, and routing configuration.
| Order | P/N | Top Pins (Package Type) | Bottom Pins (DIP) | Socket Type | Short Technical Description |
|---|---|---|---|---|---|
| 1 | PA6-SOT23 | 6 | 6 | Clamshell | SOT Programming adapter. 1:1 pinout for 6 pin SOT23 packages |
| 2 | PA05-08-1SOT3 | 5 | 8 | Clamshell | SOT Programming adapter for SOT23 to DIP, serial EEPROMs, Microchip 24xx series EEPROMs in 5 pin SOT package. Pin 4 skipped. |
| 3 | PA05-08-2SOT3 | 5 | 8 | Clamshell | SOT Programming adapter for SOT23 to DIP, serial EEPROMs |
| 4 | PA06-08-2SOT3 | 6 | 8 | Clamshell | Programming adapter for Microchip PIC10F series in 6-pin SOT package |
| 5 | PA06-08-3SOT3 | 6 | 8 | Clamshell | Programming adapter for Microchip 93xx series EEPROMs in 6 pin SOT package. |
Not Finding What You Need?
If your required SOT23 variant or DIP configuration is not listed, a custom adapter can be defined based on your device and programming system requirements.
- Provide the IC mechanical drawing (body size, lead pitch, lead count).
- Specify the required DIP format (pin count and row spacing).
- Identify the programming system or required DIP pinout reference.
- Confirm whether routing is 1:1 or device-specific.
Complete mechanical and electrical definition ensures correct fit and routing.
