SOIC to DIP

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SOIC to DIP

About

SOIC-to-DIP adapters enable Small Outline Integrated Circuit (SOIC) devices to be inserted in Dual In-line Package (DIP) footprints. These adapters include a ZIF (zero insertion Force) Socket and are essential for prototyping, testing, and programming applications, making SOIC-packaged microcontrollers, memory devices, and other ICs compatible with standard DIP sockets and breadboards.

How to Navigate

    • By Pin Count – Available in 8, 14, 16, 18, 20, 24, 28, 32, and 40 pin counts.
    • By Pitch & Body Width – SOIC packages typically have a 1.27mm pitch; match socket fit by comparing the accepted body width to your device.
    • View in Grid or Rows – Select your preferred display format for easier browsing.
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