QFP to DIP Programming Adapters

Technical Overview

QFP to DIP programming adapters convert quad flat package (QFP) devices with gull-wing leads on four sides into a dual in-line (DIP) interface compatible with standard 0.100″ pitch programming sockets and evaluation systems.

The top interface consists of a QFP socket selected by package family, pin count, pitch, body size, and tip-to-tip.

The bottom interface presents a DIP plug defined by pin count and row spacing (commonly 0.300″ or 0.600″).

Electrical routing may be configured as direct 1:1 pin mapping or as device-specific wiring when the programmer requires a defined DIP pinout different from the QFP numbering sequence. Pin skips, shorts, or remapping are implemented only when required by the device specification.

• Supported package families: TQFP, LQFP, PQFP
• Common pitches: 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, 1.00 mm
• Typical pin counts: 32 and above
• DIP formats: 0.100″ pitch, 0.300″ or 0.600″ row spacing

Mechanical Configuration

QFP to DIP programming adapters are defined by the mechanical characteristics of the QFP package and the required DIP footprint. Accurate package dimensions are required to ensure proper socket fit and contact alignment.

• Top Interface (QFP): Package family (TQFP, LQFP, PQFP), body size (A × B), lead span, pitch, and total pin count.
• Socket Type: Clamshell (lidded), ZIF, or LIF configurations selected based on pitch and insertion frequency.
• Orientation: Pin-1 identification and mechanical keying to prevent rotation errors.
• Bottom Interface (DIP): 0.100″ pitch plug with defined pin count and row spacing (0.300″ or 0.600″).
• Pin Style: Square post or machine pin depending on mating socket requirements.
• Height & Clearance: Overall assembly height and actuator clearance must match the destination programmer or fixture.

For proper definition, provide the IC mechanical drawing including pitch, lead dimensions, body size, and tolerances.

Routing Configurations

Routing defines the electrical relationship between the QFP top interface and the DIP bottom interface. The required mapping is determined by the programmer, emulator, or legacy DIP pinout specification.

• 1:1 Mapping: QFP pin numbers map directly to corresponding DIP pin numbers when the required DIP format matches the native QFP numbering.
• Device-Specific Mapping: Signals are reassigned to match a defined DIP footprint required by the programming system.
• Pin Skips: Unused pins are intentionally left unconnected when required by the target device definition.
• Pin Shorts: Specific pins may be electrically tied when mandated by the programming reference design.
• Power & Ground Handling: Multiple VCC or GND pins are routed per device requirements to maintain proper electrical reference.

For device-specific configurations, provide the target device name and required DIP pinout reference to ensure correct signal assignment.

QFP to DIP Programming Adapter Catalog

The following catalog lists standard QFP to DIP programming adapter configurations. All part numbers are defined by QFP pin count, DIP format, socket type, and routing configuration.

Not Finding What You Need?

If your required QFP package or DIP configuration is not listed in the catalog, a custom adapter can be defined based on your device and programming system requirements.

• Provide the IC mechanical drawing (package family, pitch, body size, lead span, pin count).
• Specify the required DIP format (pin count and row spacing).
• Identify the programming system or required DIP pinout reference.
• Confirm whether routing is 1:1 or device-specific.

All adapters are built to order. Complete mechanical and electrical definition ensures accurate routing and fit.

Related Adapters

• Programming Adapters (Hub)
• Production Test Adapters
• QFP to QFP Adapters

These related adapter families address alternate interface conversions, including same-footprint QFP adaptations and production test configurations.