SOIC to DIP Programming Adapters

Technical Overview

SOIC to DIP programming adapters provide a defined electrical and mechanical interface between 0.050″ (1.27 mm) pitch Small Outline Integrated Circuit (SOIC) packages and standard 0.100″ (2.54 mm) pitch DIP programming sockets.

The top interface consists of an SOIC socket selected by body width (e.g., 150 mil, 300 mil), pin count, and pitch. The bottom interface presents a DIP plug with a specified pin count and row spacing (commonly 0.300″ or 0.600″).

Routing may be configured as direct 1:1 pin mapping or device-specific mapping when required by the programming system. Pin skips or reassignment are implemented only when defined by the target device pinout.

• Package pitch: 0.050″ (1.27 mm)
• Common body widths: 150 mil, 300 mil
• Typical pin counts: 8–40+
• DIP pitch: 0.100″ (2.54 mm)
• DIP row spacing: 0.300″ or 0.600″

Mechanical Configuration

SOIC to DIP programming adapters are defined by the mechanical characteristics of the SOIC package and the required DIP footprint. Accurate body width, lead pitch, and pin count are required to ensure correct socket selection and fit.

• Top Interface (SOIC): 0.050″ (1.27 mm) pitch with defined body width (150 mil or 300 mil) and total pin count.
• Socket Type: Open-top, LIF, or clamshell configurations based on insertion frequency and pin density.
• Orientation: Pin-1 identification and silkscreen reference to prevent rotation errors.
• Bottom Interface (DIP): 0.100″ pitch plug with specified pin count and row spacing (0.300″ or 0.600″).
• Pin Style: Square post or machine pin depending on mating socket requirements.
• Assembly Height: Overall height and actuator clearance must match the destination programmer or fixture.

Provide the IC mechanical drawing including body width, lead span, pitch, and tolerances to ensure proper fit and alignment.

Routing Configurations

Routing defines the electrical relationship between the SOIC top interface and the DIP bottom interface. The required mapping is determined by the programming system or the defined DIP pinout.

• 1:1 Mapping: SOIC pin numbers correspond directly to matching DIP pin numbers when the DIP format reflects the native device numbering.
• Device-Specific Mapping: Signals are reassigned to match a defined DIP footprint required by the programming system.
• Pin Skips: Unused pins remain unconnected when defined by the target device.
• Pin Shorts: Electrical ties are implemented only when specified by the programming reference.
• Power and Ground Distribution: Supply and ground pins are routed per device requirements.

For device-specific routing, provide the target device name and required DIP pinout reference.

SOIC to DIP Programming Adapter Catalog

The following catalog lists standard SOIC to DIP programming adapter configurations defined by SOIC body width, pin count, DIP format, socket type, and routing configuration.

Not Finding What You Need?

If your required SOIC body width, pin count, or DIP configuration is not listed, a custom adapter can be defined based on your device and programming system requirements.

• Provide the IC mechanical drawing (body width, pitch, lead span, pin count).
• Specify the required DIP format (pin count and row spacing).
• Identify the programming system or required DIP pinout reference.
• Confirm whether routing is 1:1 or device-specific.

Complete mechanical and electrical definition ensures correct fit and routing.

Related Adapters

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  Programming Adapters (Hub)
  
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  DIP to SOIC Adapters
  
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  SMT SOIC to DIP Adapters