SOIC-8 to DIP-8 Programming Adapter — Open Top Socket

Overview

PA-SOD-1603-D250-08/2 is a device-specific package conversion adapter that converts an 8-pin SOIC package into a DIP footprint for engineering development and device programming workflows.

Interface

• Top interface: SOIC
• Bottom interface: DIP
• Top interface pin count: 8
• Bottom interface pin count: 8
• Pitch: 1.27mm
• Device body size: 3.9mm
• Tip-to-tip dimensions: 6.0mm (.250″)

Key Features

• Open top socket configuration
• 1:1 wiring configuration
• Supports direct device insertion and removal
• Suitable for engineering evaluation and device programming workflows

Compatibility

• JEDEC MS-012 compliant devices

Technical Specifications

• Pitch: 1.27mm
• Device body size: 3.9mm
• Tip-to-tip size: 6.0mm (.250″)
• Top interface pin count: 8
• Bottom interface pin count: 8
• Socket type: Open Top
• Wiring type: 1:1
• Supported devices: JEDEC MS-012