DIP-18 to SOIC-18 Adapter Kit — 0.300″ DIP Span, 0.310″ SOIC Body (Pack of 2)

Overview

PA-DSO-1803-D310-18/2 is a universal adapter kit that converts an 18-pin DIP interface into an 18-pin SOIC footprint, enabling DIP emulator pods or DIP-form devices to interface with standard SOIC land patterns. The kit includes one top board assembly and two SOIC plug modules.

Interface

• Top interface: DIP-18, 7.62 mm (0.300″) span
• Bottom interface: SOIC-18, 1.27 mm (0.050″) pitch
• Device body size: N/A
• Tip-to-tip dimensions: 7.87 mm (0.310″)

Key Features

• Socket type: DIP receptacle with SOIC plug modules
• Wiring type: 1:1
• Includes one top board assembly and two SOIC plug modules
• Supports DIP emulator pods and DIP-form devices on SOIC footprints

Compatibility

• Supported devices: DIP-18 emulator pods and DIP-18 devices

Technical Specifications

• Pitch: 1.27 mm (0.050″)
• Device body size (X × Y): N/A
• Tip-to-tip size: 7.87 mm (0.310″)
• Top interface pin count: 18
• Bottom interface pin count: 18
• Socket type: DIP receptacle with SOIC plug modules
• Wiring type: 1:1
• Supported devices: DIP-18 emulator pods and DIP-18 devices