DIP-24 to SOIC-24 Adapter Kit — 0.300″ DIP Span, 0.560″ SOIC Body (Pack of 2)

Overview

PA-DSO-2403-D560-24/2 is a universal adapter kit that converts a 24-pin DIP interface into a 24-pin SOIC footprint, enabling DIP emulator pods or DIP-form devices to interface with standard SOIC land patterns. The kit includes one top board assembly and two SOIC plug modules.

Interface

• Top interface: DIP-24, 7.62 mm (0.300″) span
• Bottom interface: SOIC-24, 1.27 mm (0.050″) pitch
• Device body size: N/A
• Tip-to-tip dimensions: 14.22 mm (0.560″)

Key Features

• Socket type: DIP receptacle with SOIC plug modules
• Wiring type: 1:1
• Includes one top board assembly and two SOIC plug modules
• Supports DIP emulator pods and DIP-form devices on SOIC footprints

Compatibility

• Supported devices: DIP-24 emulator pods and DIP-24 devices

Technical Specifications

• Pitch: 1.27 mm (0.050″)
• Device body size (X × Y): N/A
• Tip-to-tip size: 14.22 mm (0.560″)
• Top interface pin count: 24
• Bottom interface pin count: 24
• Socket type: DIP receptacle with SOIC plug modules
• Wiring type: 1:1
• Supported devices: DIP-24 emulator pods and DIP-24 devices